产品技术
华天科技半导体封测一站式服务商

当前位置:首页-产品技术-Memory

华天科技存储封装包含TSSOP,DFN,LGA,BGA封装,产品线涵盖Nor Flash,SPI NAND,SD NAND,3D V-NAND,eMMC,eMCP,UFS,LPDDR,DDR系列,满足客户高密度高速度

存储封装需求。

Memory产品类别:FLASH   |   DRAM  |   Embedded

1.png

1.jpg


应用领域

Solid state disk or USB flash disk 手机、车载、智能家居等多个领域。

1.jpg

代表产品

  • 3D-VNAND
    3D-VNAND

    Specification:
    Package Size: 12x18mm 132Ball
    Package thickness:1.12mm /1.32mm
    Min Die thickness: 30um
    8 die –stack/16 die –stack
    Substrate thickness:0.13mm

    Application:
    Solid state disk or USB flash disk

  • LPDDR4
    LPDDR4

    Specification:
    Package Size: 10x14.5mm 200Ball
    Package thickness: 0.92mm
    Min Die thickness: 40um
    2 die –stack/4 die –stack
    Substrate thickness:0.18mm 2L/4L

    Application:
    Mobile electronics DRAM

  • eMMC
    eMMC

    Specification:
    Package Size: 11.5x13mm 153 Ball
    Package thickness: 0.92mm
    Min Die thickness: 80um
    2 die –stack
    Substrate thickness:0.18mm 2L

    Application:
    Mobile phone, Flat PC, Smart Watch 

  • eMCP
    eMCP

    Specification:
    Package Size: 8x10.5mm 162Ball
    Package thickness: 0.92mm
    Min Die thickness: 80um
    3 die –stack
    Substrate thickness:0.18mm 2L

    Application:
    Mobile phone, Flat PC,IoT, Wearable device