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MEMS(微机电系统封装)产品具有体积小、重量轻、功耗低、灵敏度高、价格低、易批量生产等优点。
MEMS产品种类繁多,封装形式多样,产品应用范围广,随着科技的不断发展,与人类的日常生活关联越来越紧密。


1.jpgMEMS产品类别:

01 声学类:硅麦克风
02 压力类:高度计,气压计,3Dtouch
03 惯性类:加速度计,陀螺仪,6lMU
04 光学类:接近光传感器,光电传感器,Vcsel,心率传感器
05 RFMEMS:滤波器(SAW&BAW)
06 磁传感器:AMR,TMR
07 生物类:基因检测传感器
08 指纹类:光学式指纹,电容式指纹
09 热学类:温湿度传感器,温度传感器


技术能力

TSV, RDL, WLCSP, Wafer tevwel bonding, Strip level bonding FC+WB stack die, Coating protection Metal lid attach,
Glass attach Compression molding Customize molding Clear molding, Open molding Can supply ceramic, lead frame,
substrate solutions, various assembly proposal fulfill customer requirements.

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应用领域

手机,平板电脑,智能穿戴,医疗服务,工业生产,汽车电子等多种领域。

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代表产品

  • Cap Mount Product
    Cap Mount Product

    Specification:
    Package Size: 4030,3526,3729,3722,2718
    Port Location: Top / Bottom
    Cap Type: Metal / Plastic / Substrate

    Application:
    Silicon Microphone, Pressure Sensor 

  • Customized Mold  Product
    Customized Mold Product

    Specification:
    Package Type: QFN / LGA
    Mold Type: Full Open Mold / Partial Open Mold

    Application:
    THTB, Optical Sensor, Heart rate sensor etc.

  • Over Molding Product
    Over Molding Product

    Specification:
    Package Type:QFN / LGA
    Die Attach Orientation: Horizontal(0° or 180°) / Vertical (90°)

    Application:
    G-sensor, AMR/TMR , Multi-axis Inertial
    sensor,RF Filter

  • Finger Print Sensor
    Finger Print Sensor

    Specification:
    Package Type: QFN / LGA
    Mold clearance : Min. 50 um(Over Molding)
    Wire loop:Max 30um
    Package thickness:Min 0.5mm
    Package Outline: Rectangle /  Circle

    Application:
    Mobile Phone, Credit Card , Door Lock,
    Suitcase, ID Card etc.